MNE'08. The 34th International Conference on Micro- and Nano-Engineering (MNE)RAPTIS, Ioannis; GOGOLIDES, Evangelos.Microelectronic engineering. 2009, Vol 86, Num 4-6, issn 0167-9317, 1100 p.Conference Proceedings

Application of the Kriging method to the reconstruction of ellipsometric signatureAFRAITES, L; HAZART, J; SCHIAVONE, P et al.Microelectronic engineering. 2009, Vol 86, Num 4-6, pp 1033-1035, issn 0167-9317, 3 p.Conference Paper

Consequences of non-standard bleaching on microlithographic performanceFULGA, Florin; NICOLAU, Dan V.Microelectronic engineering. 2009, Vol 86, Num 4-6, pp 783-786, issn 0167-9317, 4 p.Conference Paper

Electron sources utilizing thin CsBr coatingsMALDONADO, Juan R; ZHI LIU; DOWELL, D. H et al.Microelectronic engineering. 2009, Vol 86, Num 4-6, pp 529-531, issn 0167-9317, 3 p.Conference Paper

High resolution, high sensitivity inorganic resistsSTOWERS, Jason; KESZLER, Douglas A.Microelectronic engineering. 2009, Vol 86, Num 4-6, pp 730-733, issn 0167-9317, 4 p.Conference Paper

Metal electrodes in plastic microfluidic systemsSCHROTT, Walter; SVOBODA, Milos; SLOUKA, Zdenek et al.Microelectronic engineering. 2009, Vol 86, Num 4-6, pp 1340-1342, issn 0167-9317, 3 p.Conference Paper

Stress and aging minimization in photoplastic AFM probesMARTIN, C; LLOBERA, A; VILLANUEVA, G et al.Microelectronic engineering. 2009, Vol 86, Num 4-6, pp 1226-1229, issn 0167-9317, 4 p.Conference Paper

AIN on polysilicon piezoelectric cantilevers for sensors/actuatorsGIORDANO, C; INGROSSO, I; TODARO, M. T et al.Microelectronic engineering. 2009, Vol 86, Num 4-6, pp 1204-1207, issn 0167-9317, 4 p.Conference Paper

EUV laser produced plasma source developmentFARRAR, Nigel R; BRANDT, David C; HOFFMAN, Jerzy R et al.Microelectronic engineering. 2009, Vol 86, Num 4-6, pp 509-512, issn 0167-9317, 4 p.Conference Paper

Fabrication of large-area nickel nanobump arraysCHEN, X; WEI, X; JIANG, K et al.Microelectronic engineering. 2009, Vol 86, Num 4-6, pp 871-873, issn 0167-9317, 3 p.Conference Paper

Gold cleaning methods for electrochemical detection applicationsFISCHER, Lee M; TENJE, Maria; HEISKANEN, Arto R et al.Microelectronic engineering. 2009, Vol 86, Num 4-6, pp 1282-1285, issn 0167-9317, 4 p.Conference Paper

Intracavity microfluidic dye laser droplet absorptionAUBRY, G; MEANCE, S; COURAUD, L et al.Microelectronic engineering. 2009, Vol 86, Num 4-6, pp 1368-1370, issn 0167-9317, 3 p.Conference Paper

Micro-electro-mechanical (MEM) diode switchACQUAVIVA, D; BOUVET, D; TSAMADOS, D et al.Microelectronic engineering. 2009, Vol 86, Num 4-6, pp 1074-1077, issn 0167-9317, 4 p.Conference Paper

Microfabricated diamond tip for nanoprobingARSTILA, Kai; HANTSCHEL, Thomas; DEMEULEMEESTER, Cindy et al.Microelectronic engineering. 2009, Vol 86, Num 4-6, pp 1222-1225, issn 0167-9317, 4 p.Conference Paper

Moulding of arrowhead structuresMÖLLENBECK, S; BOGDANSKI, N; SCHEER, H.-C et al.Microelectronic engineering. 2009, Vol 86, Num 4-6, pp 608-610, issn 0167-9317, 3 p.Conference Paper

Reversal μCP using hard stampsBERGMAIR, Iris; MÜHLBERGER, Michael; SCHWINGER, Wolfgang et al.Microelectronic engineering. 2009, Vol 86, Num 4-6, pp 650-653, issn 0167-9317, 4 p.Conference Paper

Electron beam induced deposited etch masksHEERKENS, C. Th. H; KAMERBEEK, M. J; VAN DORP, W. F et al.Microelectronic engineering. 2009, Vol 86, Num 4-6, pp 961-964, issn 0167-9317, 4 p.Conference Paper

Fabrication of high efficiency SOI taper structuresWAHLBRINK, Thorsten; WAN SHAO TSAI; WALDOW, Michael et al.Microelectronic engineering. 2009, Vol 86, Num 4-6, pp 1117-1119, issn 0167-9317, 3 p.Conference Paper

Fabrication of metallic oxide nanowiresGAUCHER, F; PAUTRAT, A; AUTIER-LAURENT, S et al.Microelectronic engineering. 2009, Vol 86, Num 4-6, pp 820-823, issn 0167-9317, 4 p.Conference Paper

Microscale adhesion patterns for the precise localization of amoebaTZVETKOVA-CHEVOLLEAU, Tzvetelina; YOXALL, Edward; FUARD, David et al.Microelectronic engineering. 2009, Vol 86, Num 4-6, pp 1485-1487, issn 0167-9317, 3 p.Conference Paper

Nanomanufacturing of random branching material architecturesDOUMANIDIS, Charalabos C.Microelectronic engineering. 2009, Vol 86, Num 4-6, pp 467-478, issn 0167-9317, 12 p.Conference Paper

Photopatterned PLED arrays for biosensing applicationsVASILOPOULOU, Maria; GEORGIADOU, Dimitra G; PALILIS, Leonidas C et al.Microelectronic engineering. 2009, Vol 86, Num 4-6, pp 1511-1514, issn 0167-9317, 4 p.Conference Paper

Tailoring exchange bias in magnetic nanostructuresSPELIOTIS, Th; ATHANASOPOULOS, P; CHATZICHRISTIDI, M et al.Microelectronic engineering. 2009, Vol 86, Num 4-6, pp 1063-1066, issn 0167-9317, 4 p.Conference Paper

Topography-sensitive copper deposition in supercritical solutionsKONDOH, E; NAGANO, K; YAMAMOTO, C et al.Microelectronic engineering. 2009, Vol 86, Num 4-6, pp 902-905, issn 0167-9317, 4 p.Conference Paper

Viscosity data from thermal imprint experimentsSCHEER, H.-C; BOGDANSKI, N; SHIBATA, M et al.Microelectronic engineering. 2009, Vol 86, Num 4-6, pp 688-690, issn 0167-9317, 3 p.Conference Paper